• DocumentCode
    23483
  • Title

    Variable-Length Link-Spring Model of Wire-Bonding Looping Process

  • Author

    Fuliang Wang ; Weidong Tang ; Lei Han

  • Author_Institution
    State Key Lab. of High Performance Complex Manuf., Changsha, China
  • Volume
    3
  • Issue
    8
  • fYear
    2013
  • fDate
    Aug. 2013
  • Firstpage
    1279
  • Lastpage
    1285
  • Abstract
    Looping is a key technology in modern thermosonic wire bonding. To provide insight into the loop formation mechanism, a variable-length link-spring (VLLS) model is proposed. In this model, the wire segments and moment balance equations at the opening end of the wire are dynamically added during the capillary upward movement stage, to simulate the wire feeding and kink formation process. The complete looping process is analyzed by solving nonlinear equations iteratively and using Newton´s method. Using this model, the wire profile evolution process and kink number, position, and deformation during looping are obtained and verified by experimental results. The effects of the upward loop trace parameters (reverse motion and kink height parameters) on the final loop profile are studied. The results show that the VLLS model, which considers the upward loop trace, is more suitable for looping process analysis.
  • Keywords
    Newton method; nonlinear equations; tape automated bonding; ultrasonic applications; Newton method; capillary upward movement stage; kink formation process; kink height parameter; kink number; loop formation mechanism; moment balance equation; nonlinear equations; thermosonic wire bonding; variable length link-spring model; wire bonding looping process; wire feeding process; wire profile evolution process; wire segment equation; Analytical models; Equations; Force; Gold; Mathematical model; Springs; Wires; Capillary trace; kink formation; loop profile; looping process; variable-length link-spring (VLLS) model; wire bonding;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2237773
  • Filename
    6417262