Foreword

fYear

2014

fDate

27-30 May 2014

Firstpage

1

Lastpage

2

Abstract

The following topics are dealt with: 3D and TSV technologies; wafer level packaging; electrical and mechanical modeling; RF packaging; system design and optical interconnects; advanced packaging technologies; material development and characterization; reliability; assembly and manufacturing; interposers; flexible electronics-packaging technology and application trends; wireless power transfer system; emerging technologies and market trends of silicon photonics; influence of packaging on system integration and performance; professional development courses and technology corner exhibit.

Keywords

electron device manufacture; flexible electronics; inductive power transmission; integrated circuit modelling; integrated optics; optical interconnections; professional aspects; radiofrequency integrated circuits; silicon; three-dimensional integrated circuits; wafer level packaging; 3D technologies; AD 2014; ECTC; IEEE conference; RF packaging; Si; TSV technologies; advanced packaging technologies; electrical modeling; electronic components; flexible electronics; interposers; material development; mechanical modeling; optical interconnects; professional development courses; silicon photonics; system integration; technology conference; technology corner exhibit; wafer level packaging; wireless power transfer system;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th

Conference_Location

Orlando, FL

Type

conf

DOI

10.1109/ECTC.2014.6897250

Filename

6897250