Title :
Mechanically flexible interconnects with highly scalable pitch and large stand-off height for silicon interposer tile and bridge interconnection
Author :
Chaoqi Zhang ; Hyung Suk Yang ; Bakir, Muhannad S.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper reports novel interconnect technologies to enable a large scale `interposer tile´ and `silicon bridge´ interconnection platform. Microfabricated self-alignment structures enable high alignment accuracy between the components. Mechanically flexible interconnects (MFIs) are utilized to enable rematable electrical interconnects. Moreover, a proof of concept demonstration with interposer tiles directly mounted on FR4 board and interconnected by silicon bridges is reported.
Keywords :
fine-pitch technology; integrated circuit interconnections; silicon; FR4 board; MFIs; electrical interconnects; highly scalable pitch; mechanically flexible interconnect technologies; mechanically flexible interconnects; self-alignment structures; silicon bridge interconnection platform; silicon interposer tile; Assembly; Bridges; Coatings; Resistance; Resists; Silicon; Substrates;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
DOI :
10.1109/ECTC.2014.6897260