DocumentCode :
2348748
Title :
4D-2 High Volume Production of a Fully Matched 5050 PCS-CDMA-BAW Duplexer
Author :
Schmidhammer, Edgar ; Heinze, Habbo ; Schmiedgen, Monika ; Mayer, Markus ; Link, Andreas
Author_Institution :
EPCOS AG, Munich
fYear :
2006
fDate :
2-6 Oct. 2006
Firstpage :
329
Lastpage :
332
Abstract :
Since 2001 bulk acoustic wave (BAW) technology is highly investigated due to its silicon-based technology for further integration in the RF part of e.g. mobile phones. At the IEEE UFFC Symposium 2005 in Rotterdam EPCOS presented the very first results of several CDMA related components like 3838 PCS BAW duplexer, full-band Tx-filter and Rx diversity filter using the solidly mounted resonator (SMR) technique and packaged using EPCOS´ proprietary CSSPlus technology [Schmidhammer, E, et al.]. Meanwhile we have successfully started the high-volume production of a fully matched 5050 PCS BAW Duplexer, a component, which was requested by various customers. This BAW duplexer has been specifically designed to match the impedance network commonly employed at the PA output path, transforming the PA output impedance level of approx. 3 Omega into the 50 Omega reference level. Qualification tests according to JEDEC and IEC standards show a high reliability of the component with respect to temperature-shocks (-40deg/125deg), damp heat steady state tests (85 degC/85% relative humidity) and high temperature storage (125 degC). These quality levels were mainly achieved by employing a newly developed Ni-based UBM. The presented results show clearly our continuing improvements within SMR-BAW technology. Our process flow using a 200 mm manufacturing line uses only the minimum number of process steps by still keeping a high yield in combination with high process stability and high process robustness. EPCOS is the first component supplier worldwide deploying high-volume production based on 200 mm wafers
Keywords :
bulk acoustic wave devices; code division multiple access; multiplexing equipment; personal communication networks; -40 C; 125 C; 200 mm; 5050 PCS-CDMA-BAW duplexer; 85 C; EPCOS; IEC standards; IEEE UFFC Symposium 2005; International Electrotechnical Commission; JEDEC standards; Joint Electron Device Engineering Council; bulk acoustic wave technology; code division multiple access; damp heat steady state tests; high temperature storage; impedance network; nickel-based UBM; personal communications service; process robustness; process stability; temperature-shocks; underbump metallization; Acoustic waves; Impedance; Mobile handsets; Multiaccess communication; Personal communication networks; Production; Radio frequency; Resonator filters; Robust stability; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2006. IEEE
Conference_Location :
Vancouver, BC
ISSN :
1051-0117
Print_ISBN :
1-4244-0201-8
Electronic_ISBN :
1051-0117
Type :
conf
DOI :
10.1109/ULTSYM.2006.95
Filename :
4151951
Link To Document :
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