• DocumentCode
    2348830
  • Title

    Comparative ODE benchmarking of unidirectional and bidirectional DP networks for 3D-IC

  • Author

    Lam, K.P. ; Mak, Terrence S T ; Poon, C.-S.

  • Author_Institution
    Dept. of Syst. Eng. & Eng. Manage., Chinese Univ. of Hong Kong, Hong Kong, China
  • fYear
    2011
  • fDate
    3-5 Oct. 2011
  • Firstpage
    98
  • Lastpage
    101
  • Abstract
    There has been great technological stride in 3D-IC on its design, analysis, and fabrication, with prediction that they will eventually lead to significant advances in multicore, multiprocessor, and network-on-chip (NoC) systems. A dynamic programming (DP) network is well suited for the grid stack architecture, because of its capability to achieve global optimality using only local computational units with short inter-grid communication links. In this paper we extend the transitive closure and shortest path unidirectional networks to bidirectional networks, with the development of an effective simulation tool for such type of DP networks. In addition to helping to construct real DP networks on 3D-IC, ODE (ordinary differential equation) simulation methodology for solving an average shortest path length problem provides new insights for comparative bench-marking very large-scale 2D/3D networks for different design considerations in application.
  • Keywords
    difference equations; dynamic programming; integrated circuit design; three-dimensional integrated circuits; 3D IC; IC design; NoC; ODE benchmarking; bidirectional DP network; bidirectional network; dynamic programming; grid stack architecture; multicore processor system; multiprocessor system; network-on-chip; ordinary differential equation; shortest path unidirectional network; transitive closure; unidirectional DP network; Benchmark testing; Computer architecture; Dynamic programming; Educational institutions; Integrated circuit interconnections; Integrated circuit modeling; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI and System-on-Chip (VLSI-SoC), 2011 IEEE/IFIP 19th International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4577-0171-9
  • Electronic_ISBN
    978-1-4577-0169-6
  • Type

    conf

  • DOI
    10.1109/VLSISoC.2011.6081659
  • Filename
    6081659