Title :
4D-5 BAW Technologies: Development and Applications within MARTINA, MIMOSA and MOBILIS IST European Projects (Invited)
Author :
Kerherve, E. ; Ancey, P. ; Aid, M. ; Kaiser, A.
Author_Institution :
IXL Lab., Bordeaux Univ.
Abstract :
The paper presents recent results obtained with FBAR and SMR BAW resonators for radiofrequency microelectronics applications within three European projects. The design and implementation of an RF front-end for WCDMA applications using an above-IC BAW band-pass filter is reported (SoC integration) from MARTINA European project. The second European project (MIMOSA) proposes a SiP integration to make an ISM-band wake-up radio receiver using a selective low-noise amplifier (LNA). The selectivity is assured by a SMR-type BAW bandpass filter. The CMOS IC chip and the BAW filter are connected together by wire-bonding or by flip-chipping. The objective of the third European project (MOBILIS) is to develop a robust and cost-effective integrated high-power RF filtering technology and demonstrate the feasibility of a mixed SoC (nanometric CMOS/system integration) and SiP (BiCMOS/power-BAW) RF power transmitter. The targeted transmitter is based on a digital radio transmitter architecture and addresses both the WCDMA and DCS standards. Finally, some solutions are proposed to address the BAW technology future challenges in terms of high frequency applications (> 10 GHz), multi-standard reconfigurability, one-chip radio and combined ladder-stage with lattice stage
Keywords :
acoustic resonators; band-pass filters; bulk acoustic wave devices; radiofrequency integrated circuits; surface mount technology; BAW technology; BiCMOS-power-BAW; CMOS IC chip; DCS standards; FBAR resonators; ISM-band wake-up radio receiver; MARTINA European project; MIMOSA European project; MOBILIS IST European project; RF filtering technology; RF power transmitter; SMR BAW resonators; SMR-type BAW bandpass filter; SiP integration; SoC integration; WCDMA applications; WCDMA standards; above-IC BAW band-pass filter; bulk acoustic wave; digital radio transmitter architecture; film bulk acoustic resonator; flip-chipping; ladder-stage-lattice stage combination; low-noise amplifier; multistandard reconfigurability; nanometric CMOS-system integration; one-chip radio; radiofrequency microelectronics; solidly mounted resonator; system-in-package; system-on-chip; wideband code division multiple access; wire-bonding; Band pass filters; CMOS integrated circuits; CMOS technology; Film bulk acoustic resonators; Low-noise amplifiers; Microelectronics; Multiaccess communication; Radio frequency; Radio transmitters; Receivers;
Conference_Titel :
Ultrasonics Symposium, 2006. IEEE
Conference_Location :
Vancouver, BC
Print_ISBN :
1-4244-0201-8
Electronic_ISBN :
1051-0117
DOI :
10.1109/ULTSYM.2006.101