• DocumentCode
    2348900
  • Title

    4D-4 Fabrication of FBAR for GHz Band Pass Filter with AlN Film Grown Using MOCVD

  • Author

    Aota, Y. ; Sakyu, Y. ; Tanifuji, S. ; Oguma, H. ; Kameda, S. ; Nakase, H. ; Takagi, T. ; Tsubouchi, K.

  • Author_Institution
    Res. Inst. of Electr. Commun., Tohoku Univ., Sendai
  • fYear
    2006
  • fDate
    2-6 Oct. 2006
  • Firstpage
    337
  • Lastpage
    340
  • Abstract
    Film bulk acoustic resonator (FBAR) using AlN film was fabricated. Metal-organic chemical vapor deposition (MOCVD) was used to obtain high oriented AlN (0002) film. The unloaded Q factor (Qscrr) of fabricated FBAR was improved by reduction of Mo electrode resistance and optimization of cavity etching process. Since Mo nitridation degraded Mo resistance, reaction time between Mo and NH3 became shorter than conventional process to suppress the nitridation during AlN deposition. As a result, Mo resistance was improved to be 12.3 muOmegacm from 26.4 muOmegacm. In conventional process using Bosch process to fabricate cavities, insufficient etching selection ratio between Si/SiO2 of 200 brought incomplete structure of cavities. The etching selection ratio between Si/SiO2 was improved to be 650 by change of the etching process. The evaluated Qscrr of the fabricated FBAR was as high as 1557 at 3.698 GHz. We achieved the high Qscrr value FBAR using high oriented AlN (0002) film by the MOCVD method
  • Keywords
    MOCVD; acoustic resonators; aluminium compounds; band-pass filters; bulk acoustic wave devices; 3.698 GHz; Bosch process; FBAR; MOCVD; Mo; NH3; Q factor; band pass filter; cavity etching process; electrode resistance; etching selection ratio; film bulk acoustic resonator; metal-organic chemical vapor deposition; nitridation; Band pass filters; Electrodes; Etching; Fabrication; Film bulk acoustic resonators; MOCVD; Piezoelectric films; Piezoelectric materials; Radio frequency; Resonator filters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2006. IEEE
  • Conference_Location
    Vancouver, BC
  • ISSN
    1051-0117
  • Print_ISBN
    1-4244-0201-8
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2006.103
  • Filename
    4151959