DocumentCode :
2349206
Title :
Properties of 22nm node extremely-thin-SOI MOSFETs
Author :
Rodriguez, N. ; Andrieu, F. ; Navarro, C. ; Faynot, O. ; Gamiz, F. ; Cristoloveanu, S.
Author_Institution :
Dept. Electron., Univ. of Granada, Granada, Spain
fYear :
2011
fDate :
3-6 Oct. 2011
Firstpage :
1
Lastpage :
2
Abstract :
We have investigated the characteristics of 6nm thick, 22nm-node SOI MOSFETs by comparing the transport properties at the front (high-k) and back (SiO2) interfaces in a temperature range from -50° to 250°C. In addition to the mobility degradation with the channel length, an unusual mobility decrease at the SiO2 interface is observed in very narrow devices. For the shorter, narrower and thinner devices the transport characteristics tend to be the same regardless the interface where the carriers flow. Finally interface coupling dependence has been used to extract the density of states at the back interface.
Keywords :
MOSFET; high-k dielectric thin films; silicon compounds; silicon-on-insulator; SiO2; back interface; extremely-thin-SOI MOSFET; front high-k interface; interface coupling dependence; mobility degradation; size 22 nm; size 6 nm; temperature 50 degC to 250 degC; transport property; Degradation; Electron mobility; Logic gates; Strain; Temperature; Threshold voltage; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference (SOI), 2011 IEEE International
Conference_Location :
Tempe, AZ
ISSN :
1078-621X
Print_ISBN :
978-1-61284-761-0
Electronic_ISBN :
1078-621X
Type :
conf
DOI :
10.1109/SOI.2011.6081681
Filename :
6081681
Link To Document :
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