DocumentCode
234925
Title
Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips
Author
Barwicz, Tymon ; Taira, Yoichi ; Numata, Hidetoshi ; Boyer, Nicolas ; Harel, S. ; Kamlapurkar, Swetha ; Takenobu, Shotaro ; Laflamme, Simon ; Engelmann, Steve ; Vlasov, Yurii ; Fortier, Paul
Author_Institution
IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
2014
fDate
27-30 May 2014
Firstpage
179
Lastpage
185
Abstract
Silicon nanophotonics may bring disruptive advances to datacom, telecom, and high performance computing. However, the deployment of this technology is hampered by the difficulty of cost efficient optical inputs and outputs. To address this challenge, we have recently proposed a low-cost, mechanically compliant polymer interface between standard single mode fibers and nanophotonic waveguides. Our concept promises better mechanical reliability and better optical performance than existing technology. To manage the cost of assembly, we show here that self-alignment features can be effectively used to bridge the gap between the accuracy required by single-mode optics (1-2 um) and the capability of high-throughput microelectronic assembly equipment (~10 um). We describe the complaint interface, the assembly strategy, and the design of our re-alignment features. We demonstrate experimentally that misalignments at assembly as large as +/-10 um are re-aligned by our self-alignment structures to +/-1 to 2 um. Our approach enables existing microelectronics equipment to be used for singlemode optics assembly.
Keywords
integrated circuits; nanophotonics; optical fibres; polymers; datacom; high performance computing; microelectronic assembly; nanophotonic chips; nanophotonic waveguides; optical fibers; optical inputs; optical outputs; polymer interface; single mode fibers; singlemode optics assembly; telecom; Accuracy; Assembly; Optical device fabrication; Optical fiber cables; Optical polymers; Optical waveguides;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location
Orlando, FL
Type
conf
DOI
10.1109/ECTC.2014.6897286
Filename
6897286
Link To Document