Title :
Input/Output Pad for Direct Contact and Contactless Testing
Author :
Scandiuzzo, M. ; Cani, S. ; Perugini, L. ; Spolzino, S. ; Canegallo, R. ; Perilli, L. ; Cardu, R. ; Franchi, E. ; Gozzi, C. ; Maggioni, F.
Author_Institution :
TR&D-CCDS, ST Microelectron., Agrate Brianza, Italy
Abstract :
Non-contact probing can provide an important contribution for testing complex Systems-on-a-Chip (SoC), Systems-in-a-Package (SiP) and Through-Silicon-Vias (TSV) interconnections. This paper demonstrates the feasibility of wireless testing by capacitive coupling between a cantilever probe card and a pad. In particular a scheme of an I/O pad suitable for both contact and contactless probing is proposed.
Keywords :
cantilevers; integrated circuit interconnections; probes; system-in-package; system-on-chip; three-dimensional integrated circuits; SiP; SoC; TSV interconnection; cantilever probe card; capacitive coupling; contactless testing; direct contact; input-output pad; noncontact probing; systems-in-a-package; systems-on-a-chip; through-silicon-vias interconnection; Couplings; Needles; Probes; Receivers; Testing; Wireless communication; Wireless sensor networks; I/O; SiP; capacitive coupling; wireless probing;
Conference_Titel :
Test Symposium (ETS), 2011 16th IEEE European
Conference_Location :
Trondheim
Print_ISBN :
978-1-4577-0483-3
Electronic_ISBN :
1530-1877
DOI :
10.1109/ETS.2011.24
