• DocumentCode
    2349456
  • Title

    Thermal stability of Cu/CoSi2 contacted p+n shallow junction with and without TiNx diffusion barrier

  • Author

    Chiou, Jung-Chao ; Chen, Mao-Chieh

  • Author_Institution
    National Chiao-Tung University
  • fYear
    1994
  • fDate
    1994
  • Keywords
    Cobalt; Copper; Degradation; Diodes; Electric variables; Rapid thermal annealing; Silicides; Temperature; Thermal stability; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Materials Symposium, 1994. EDMS 1994. 1994 International
  • Type

    conf

  • DOI
    10.1109/EDMS.1994.863887
  • Filename
    863887
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2349456