Title :
Thermal stability of Cu/CoSi2 contacted p+n shallow junction with and without TiNx diffusion barrier
Author :
Chiou, Jung-Chao ; Chen, Mao-Chieh
Author_Institution :
National Chiao-Tung University
Keywords :
Cobalt; Copper; Degradation; Diodes; Electric variables; Rapid thermal annealing; Silicides; Temperature; Thermal stability; Tin;
Conference_Titel :
Electron Devices and Materials Symposium, 1994. EDMS 1994. 1994 International
DOI :
10.1109/EDMS.1994.863887
