Title :
Adhesive enabling technology for directly plating metal on molding resin
Author :
Kwonil Kim ; Mukai, Koji ; Eastep, Brian ; Gaherty, Lee ; Kashyap, Arti ; Brandt, Lutz
Author_Institution :
Atotech USA Inc., Englewood, CO, USA
Abstract :
This paper aims to introduce a new wet chemical process for adhesion enhancement of plated metal to epoxy molding compounds (EMC). The approach is based on an innovative combination of mechanical anchoring and chemical adhesion. The new approach broadens possible application ranges and replaces more limited processes such as sandblasting and sputtering, which have cost and technical drawbacks.
Keywords :
adhesives; electroplating; moulding; resins; sandblasting; sputtering; EMC; adhesion enhancement; adhesive enabling technology; chemical adhesion; directly plating metal; epoxy molding compounds; mechanical anchoring; molding resin; plated metal; sandblasting; sputtering; wet chemical process;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
DOI :
10.1109/ECTC.2014.6897299
