DocumentCode
234952
Title
Adhesive enabling technology for directly plating metal on molding resin
Author
Kwonil Kim ; Mukai, Koji ; Eastep, Brian ; Gaherty, Lee ; Kashyap, Arti ; Brandt, Lutz
Author_Institution
Atotech USA Inc., Englewood, CO, USA
fYear
2014
fDate
27-30 May 2014
Firstpage
279
Lastpage
283
Abstract
This paper aims to introduce a new wet chemical process for adhesion enhancement of plated metal to epoxy molding compounds (EMC). The approach is based on an innovative combination of mechanical anchoring and chemical adhesion. The new approach broadens possible application ranges and replaces more limited processes such as sandblasting and sputtering, which have cost and technical drawbacks.
Keywords
adhesives; electroplating; moulding; resins; sandblasting; sputtering; EMC; adhesion enhancement; adhesive enabling technology; chemical adhesion; directly plating metal; epoxy molding compounds; mechanical anchoring; molding resin; plated metal; sandblasting; sputtering; wet chemical process;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location
Orlando, FL
Type
conf
DOI
10.1109/ECTC.2014.6897299
Filename
6897299
Link To Document