Title :
Low-cost TSH (through-silicon hole) interposers for 3D IC integration
Author :
Lau, John H. ; Ching-Kuan Lee ; Chau-Jie Zhan ; Sheng-Tsai Wu ; Yu-Lin Chao ; Ming-Ji Dai ; Ra-Min Tain ; Heng-Chieh Chien ; Chun-Hsien Chien ; Ren-Shin Cheng ; Yu-Wei Huang ; Yuan-Chang Lee ; Zhi-Cheng Hsiao ; Wen-Li Tsai ; Pai-Cheng Chang ; Huan-Chun Fu
Author_Institution :
Electron. & Optoelectron. Res. Lab., Ind. Technol. Res. Inst., Hsinchu, Taiwan
Abstract :
In this investigation, a SiP (system-in-package) which consists of a very low-cost interposer with through-silicon holes (TSHs) and with chips on its top- and bottom-side (a real 3D IC integration) is studied. Emphasis is placed on the fabrication of a test vehicle to demonstrate the feasibility of this SiP technology. The design, materials, and process of the top-chip, bottom-chip, TSH interposer, and final assembly will be presented. Shock and thermal cycling tests will be preformed to demonstrate the integrity of the SiP structure.
Keywords :
system-in-package; three-dimensional integrated circuits; SiP; TSH interposer; real 3D IC integration; system-in-package; through-silicon holes; very low-cost interposer; Resists; Silicon; Strips; Substrates; Through-silicon vias; Tin;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
DOI :
10.1109/ECTC.2014.6897301
