DocumentCode :
2349591
Title :
Breakdown mechanisms and stress-induced leakage current in ultra-thin oxides and N2O oxynitrides
Author :
Chou, Anthony I. ; Lai, Kafai ; Kumar, Gran ; Chowdhury, Prasenjit ; Hao, Ming-Yin ; Chen, Wei-Ming ; Gardner, Michael ; Fulford, J. ; Lee, Jack C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
fYear :
1995
fDate :
16-17 May 1995
Firstpage :
90
Lastpage :
93
Abstract :
In this paper, we investigate breakdown mechanisms and stress-induced leakage current (SILC) for conventional thermal oxides and N2O oxynitrides. The role of hole generation and trapping in the breakdown of both thermal oxides and oxynitrides is studied in samples with thicknesses ranging from 33-87 Å. SILC characteristics of these dielectrics thicknesses are scaled downwards; instead there is a “turnaround” near a thickness of 50 Å
Keywords :
dielectric thin films; electric breakdown; hole traps; leakage currents; N2O; SiO2; SiON; breakdown; dielectrics; hole generation; hole trapping; oxynitrides; stress-induced leakage current; thermal oxides; ultra-thin films; Dielectric breakdown; Dielectric devices; Dielectric measurements; Dielectric substrates; Electric breakdown; Leakage current; Lifting equipment; Microelectronics; Thermal stresses; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
University/Government/Industry Microelectronics Symposium, 1995., Proceedings of the Eleventh Biennial
Conference_Location :
Austin, TX
ISSN :
0749-6877
Print_ISBN :
0-7803-2596-6
Type :
conf
DOI :
10.1109/UGIM.1995.514122
Filename :
514122
Link To Document :
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