• DocumentCode
    2349750
  • Title

    3F-3 Liquid Sensor Using SAW and SH-SAW on Quartz

  • Author

    Yatsuda, Hiromi ; Kogai, Takashi

  • Author_Institution
    Res. & Dev. Dept., Japan Radio Co., Ltd., Fujimino-shi
  • fYear
    2006
  • fDate
    2-6 Oct. 2006
  • Firstpage
    552
  • Lastpage
    555
  • Abstract
    One-chip sensor system using two different acoustic waves on ST-cut quartz is presented; one is shear horizontal surface acoustic wave (SH-SAW) and the other is surface acoustic wave (SAW). On the sensor chip, there is a SH-SAW delay-line that is composed of a transmitting interdigital transducer (IDT), receiving IDT and a biochemical reaction area in between them. And there is another IDT on the sensor chip, that can excite a Rayleigh type SAW to the biochemical reaction area in the direction normal to the SH-SAW propagation direction. In order to evaluate the performance of the SH-SAW delay-line sensor, C-reactive protein antibodies with different concentrations are provided to the biochemical reaction area. The phase change in the S21 response of the SH-SAW delay-line at a fixed frequency are measured on real-time and it is confirmed that different phase changes are obtained for different antibody concentrations. On the other hand, the one-chip quartz-based liquid-phase SH-SAW delay-line sensors with pumping and agitating functions using SAW are demonstrated
  • Keywords
    biosensors; interdigital transducers; proteins; quartz; surface acoustic wave delay lines; surface acoustic wave sensors; C-reactive protein antibodies; Rayleigh type SAW; SH-SAW delay-line sensor; ST-cut quartz; SiO2; acoustic waves; biochemical reaction area; liquid sensor; one-chip sensor system; shear horizontal surface acoustic wave; transmitting interdigital transducer; Acoustic sensors; Acoustic transducers; Acoustic waves; Biosensors; Chemical transducers; Delay; Frequency; Proteins; Sensor systems; Surface acoustic waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2006. IEEE
  • Conference_Location
    Vancouver, BC
  • ISSN
    1051-0117
  • Print_ISBN
    1-4244-0201-8
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2006.143
  • Filename
    4151999