Title :
Design and optimization of a 5 GHz CMOS power amplifier
Author :
Ko, Yus ; Eisenstadt, William R. ; PavioI, J.R.
Keywords :
Bonding; Circuits; Costs; Design optimization; Packaging; Power amplifiers; Power generation; Radiofrequency amplifiers; Semiconductor device modeling; Wireless LAN;
Conference_Titel :
Wireless and Microwave Technology, 2005. WAMICON 2005. The 2005 IEEE Annual Conference
Print_ISBN :
0-7803-8861-5
DOI :
10.1109/WAMIC.2005.1528397
