Die-on-wafer and wafer-level 3D integration for millimeter-wave smart antenna transceivers

Author

Hella, M.M. ; Devarajan, S. ; Lu, J.-Q. ; Rose, K. ; Gutmann, R.J.

Author_Institution

Center for Integrated Electron., Rensselaer Polytech. Inst., Troy, NY

fYear

2005

fDate

6-7 April 2005

Firstpage

125

Lastpage

128

Abstract

A three-dimensional (3D) IC technology platform for high-performance, heterogeneous integration of silicon ICs for mm-wave smart antenna transceivers is presented. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. A low noise amplifier (LNA), power amplifier (PA), and an analog-to-digital converter (ADC) are designed in RF-enhanced SiGe BiCMOS process to operate in the 24 GHz ISM band These critical design blocks serve as a step towards the realization of a complete system integrated with I/O matching networks, switches, antennas, and digital processing in a 3D configuration

Keywords

BiCMOS integrated circuits; adaptive antenna arrays; analogue-digital conversion; integrated circuit design; millimetre wave antenna arrays; millimetre wave integrated circuits; millimetre wave power amplifiers; receiving antennas; semiconductor materials; silicon compounds; transmitting antennas; wafer-scale integration; 24 GHz; I/O matching networks; LNA; RF-enhanced SiGe BiCMOS process; SiGe; analog-to-digital converter; copper damascene patterning; die-on-wafer; dielectric adhesive bonding; fully-processed wafer-to-wafer aligned IC; inter-wafer interconnects; low noise amplifier; millimeter-wave smart antenna transceivers; power amplifier; silicon IC; switches; three-dimensional IC technology platform; three-step thinning process; wafer-level 3D integration; Analog-digital conversion; Copper; Dielectrics; Integrated circuit noise; Low-noise amplifiers; Millimeter wave technology; Power system interconnection; Silicon; Transceivers; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Wireless and Microwave Technology, 2005. WAMICON 2005. The 2005 IEEE Annual Conference

Conference_Location

Clearwater Beach, FL

Print_ISBN

0-7803-8861-5

Type

conf

DOI

10.1109/WAMIC.2005.1528399

Filename

1528399