• DocumentCode
    2350144
  • Title

    Electrical testing and simulation in the Microelectronic Engineering Department at RIT

  • Author

    Pearson, Robert ; Hildreth, Scott ; Smeenge, J.M. ; Kroezen, Harm

  • Author_Institution
    Dept. of Microelectron. Eng., Rochester Inst. of Technol., NY, USA
  • fYear
    1995
  • fDate
    16-17 May 1995
  • Firstpage
    241
  • Lastpage
    244
  • Abstract
    The education of a microelectronic process engineer involves a number of disciplines that must be woven together in the curriculum. The overall goal that a process engineer strives for is improvement of the product. Certain classes may focus on analyzing and improving individual processes such as plasma etching. The data collected for an individual process may not be easy to link to final product performance parameters. The final product´s improvement is typically monitored by measurement of device or circuit electrical parameters. Electrical testing done in manufacturing classes then plays a key role in the education of a microelectronic engineer. The goal is to have the collected data tie together processing device physics, electronics and statistics course work. This paper describes the broad approach RIT has used to meet this goal
  • Keywords
    educational courses; electronic engineering education; integrated circuit design; integrated circuit manufacture; integrated circuit testing; production testing; IC testing; Microelectronic Engineering Department; education; electrical testing; manufacturing classes; microelectronic process engineers; simulation; Condition monitoring; Educational products; Etching; Microelectronics; Plasma applications; Plasma devices; Plasma materials processing; Plasma measurements; Plasma simulation; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    University/Government/Industry Microelectronics Symposium, 1995., Proceedings of the Eleventh Biennial
  • Conference_Location
    Austin, TX
  • ISSN
    0749-6877
  • Print_ISBN
    0-7803-2596-6
  • Type

    conf

  • DOI
    10.1109/UGIM.1995.514153
  • Filename
    514153