Title :
Interaction between metal packages and the enclosed MMICs
Author :
Bolz, Th. ; Neuhaus, B. ; Beyer, A.
Keywords :
Admittance; Current density; Equivalent circuits; Green´s function methods; Impedance; MMICs; Packaging; Transmission line matrix methods; Transmission line theory; Voltage;
Conference_Titel :
Wireless and Microwave Technology, 2005. WAMICON 2005. The 2005 IEEE Annual Conference
Print_ISBN :
0-7803-8861-5
DOI :
10.1109/WAMIC.2005.1528404
