• DocumentCode
    2350339
  • Title

    A soft error rate analysis (SERA) methodology

  • Author

    Zhang, Ming ; Shanbhag, Naresh R.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
  • fYear
    2004
  • fDate
    7-11 Nov. 2004
  • Firstpage
    111
  • Lastpage
    118
  • Abstract
    We present a soft error rate analysis (SERA) methodology for combinational and memory circuits. SERA is based on a modeling and analysis-based approach that employs a judicious mix of probability theory, circuit simulation, graph theory and fault simulation. SERA achieves five orders of magnitude speed-up over Monte Carlo based simulation approaches with less than 5% error. Dependence of soft error rate (SER) of combinational circuits on supply voltage, clock period, latching window, circuit topology, and input vector values are explicitly captured and studied for a typical 0.18 μm CMOS process. Results show that the SER of logic is a much stronger function of timing parameters than the supply voltage. Also, an "SER peaking" phenomenon in multipliers is observed where the center bits have an SER that is in order of magnitude greater than that of LSBs and MSBs.
  • Keywords
    CMOS integrated circuits; circuit simulation; combinational circuits; graph theory; memory architecture; probability; 0.18 micron; CMOS; SER peaking phenomenon; SERA methodology; analysis-based approach; circuit simulation; circuit topology; clock period; combinational circuit; fault simulation; graph theory; input vector values; latching window; memory circuits; probability theory; soft error rate analysis; supply voltage; timing parameters; Analytical models; Circuit faults; Circuit simulation; Circuit topology; Clocks; Combinational circuits; Error analysis; Graph theory; Monte Carlo methods; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Aided Design, 2004. ICCAD-2004. IEEE/ACM International Conference on
  • ISSN
    1092-3152
  • Print_ISBN
    0-7803-8702-3
  • Type

    conf

  • DOI
    10.1109/ICCAD.2004.1382553
  • Filename
    1382553