• DocumentCode
    2350388
  • Title

    An overview on the modeling of silicon piezoresistive pressure microsensors

  • Author

    Fraga, M.A. ; Koberstein, L.L.

  • Author_Institution
    Lab. de Plasmas e Processos, Inst. Tecnol. de Aeronaut., São José dos Campos, Brazil
  • fYear
    2012
  • fDate
    2-4 May 2012
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper describes the modeling of a silicon piezoresistive pressure microsensor. The main feature involved in the design of a pressure sensor is the sensitivity. Here, the sensor sensitivity was related to the ratio between width and thickness of the diaphragm. The sensor was designed by an analytical solution. The diaphragm was considered a thin plate and the piezoresistors are arranged in the Wheatstone bridge configuration. This device analytically designed was analyzed by Finite Element Method (FEM). Four models were used to simulate the sensor: 2D diaphragm, 3D diaphragm, 1/4 of the sensor and entire sensor. Comparison between FEM and analytical results shows a small variation. The paper also discusses the linearity of the microsensor and the temperature effects.
  • Keywords
    finite element analysis; microsensors; piezoresistive devices; pressure sensors; silicon; 2D diaphragm; 3D diaphragm; FEM; Si; Wheatstone bridge; finite element method; piezoresistive pressure microsensors; piezoresistors; pressure sensor design; thin plate; Finite element methods; Microsensors; Piezoresistance; Piezoresistive devices; Silicon; Stress; microsensor; modeling; piezorsistive effect; silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering Applications (WEA), 2012 Workshop on
  • Conference_Location
    Bogota
  • Print_ISBN
    978-1-4673-0871-7
  • Type

    conf

  • DOI
    10.1109/WEA.2012.6220091
  • Filename
    6220091