DocumentCode
2350388
Title
An overview on the modeling of silicon piezoresistive pressure microsensors
Author
Fraga, M.A. ; Koberstein, L.L.
Author_Institution
Lab. de Plasmas e Processos, Inst. Tecnol. de Aeronaut., São José dos Campos, Brazil
fYear
2012
fDate
2-4 May 2012
Firstpage
1
Lastpage
6
Abstract
This paper describes the modeling of a silicon piezoresistive pressure microsensor. The main feature involved in the design of a pressure sensor is the sensitivity. Here, the sensor sensitivity was related to the ratio between width and thickness of the diaphragm. The sensor was designed by an analytical solution. The diaphragm was considered a thin plate and the piezoresistors are arranged in the Wheatstone bridge configuration. This device analytically designed was analyzed by Finite Element Method (FEM). Four models were used to simulate the sensor: 2D diaphragm, 3D diaphragm, 1/4 of the sensor and entire sensor. Comparison between FEM and analytical results shows a small variation. The paper also discusses the linearity of the microsensor and the temperature effects.
Keywords
finite element analysis; microsensors; piezoresistive devices; pressure sensors; silicon; 2D diaphragm; 3D diaphragm; FEM; Si; Wheatstone bridge; finite element method; piezoresistive pressure microsensors; piezoresistors; pressure sensor design; thin plate; Finite element methods; Microsensors; Piezoresistance; Piezoresistive devices; Silicon; Stress; microsensor; modeling; piezorsistive effect; silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering Applications (WEA), 2012 Workshop on
Conference_Location
Bogota
Print_ISBN
978-1-4673-0871-7
Type
conf
DOI
10.1109/WEA.2012.6220091
Filename
6220091
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