TSV reliability model under various stress tests

Through Silicon Via (TSV) is the key technology for the 2.5D and 3D packaging, but reliability evaluations on the new technology products are limited because of the complexity of the environmental issues. To this end, reliability experiments on self-design TSV samples under combinations of several different environmental variables were proposed and performed in this study. The Weibull distribution model was next employed for reliability analyses and the parameters for each of the experimental results were extracted. After analyzing the Weibull parameters, factors that accelerate TSV unreliability are compared with discussions. This paper finally presents failure analyses through OM/SEM observations.