• DocumentCode
    235096
  • Title

    Low loss conductors for CMOS and through glass/silicon via (TGV/TSV) structures using eddy current cancelling superlattice structure

  • Author

    Rahimi, Azar ; Yong-Kyu Yk Yoon

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Florida, Gainesville, FL, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    736
  • Lastpage
    741
  • Abstract
    Superlattice structures consisting of non-ferromagnetic/ferromagnetic metals have been used to create high performance conductors for radio frequency (RF) transmission lines and low loss vias in CMOS and through silicon/glass via (TSV/TGV) structures, whose ohmic resistance and RC delays have been greatly reduced. Two permalloys of Ni80Fe20 and FeCo are studied as the ferromagnetic materials with low and high magnetization saturation that can be used for designing superlattice structures with low and high GHz frequency ranges, respectively. The effects of design parameters including the number of layers and thickness ratio of the superlattice structures have been studied. Full wave simulations have been used to verify them. Finally, a radial superlattice structure consisting of Cu/NiFe layers has been implemented and its resistance has been compared with the control solid-core devices made of copper; proving the effectiveness of the proposed radial superlattice structure for reducing the RF loss.
  • Keywords
    CMOS integrated circuits; cobalt alloys; conductors (electric); copper; eddy currents; iron alloys; nickel alloys; superlattices; three-dimensional integrated circuits; CMOS; Cu-NiFe; FeCo; Ni80Fe20; RC delays; TGV; TSV; eddy current; ferromagnetic materials; low loss conductors; non-ferromagnetic/ferromagnetic metals; ohmic resistance; radial superlattice structure; radio frequency transmission lines; solid-core devices; superlattice structures; through glass/silicon via structures; Conductors; Eddy currents; Permeability; Resistance; Skin; Superlattices; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
  • Conference_Location
    Orlando, FL
  • Type

    conf

  • DOI
    10.1109/ECTC.2014.6897366
  • Filename
    6897366