Title :
Analysis on interference between Multi-Giga bit display serial link and RF components in Smart Mobile Device
Author :
Youchul Jeong ; Jaemin Kim ; Baegin Sung
Author_Institution :
Silicon Image Inc., Sunnyvale, CA, USA
Abstract :
In Smart Mobile Devices, many components are integrated in a small space while each of them is operating at higher frequency ever. In the case of RF components, they are working at a specific single frequency, and it is relatively easy to avoid the interference by allocating the frequency band adequately. However the digital signal which is used in cutting-edge application processor and Multi-Giga bit display serial link does not have a single frequency but has a broad frequency spectrum, and it is very hard to avoid a frequency conflict between digital components or between digital and RF components. RF components are especially vulnerable to external noise, so the high-speed serial link usually becomes a noise source and RF components become its victim. In this paper, we analyzed noise emissions from various components on a Multi-Giga bit display serial link channel, and we found out how the interference between the link and RF components can be minimized, and signal integrity of the link can be improved by proper design.
Keywords :
printed circuits; radiofrequency interference; smart phones; RF components; broad frequency spectrum; cutting-edge application processor; digital signal; external noise; high-speed serial link; interference analysis; multi-giga bit display serial link channel; noise emissions; signal integrity; smart mobile device; Connectors; Copper; Electrostatic discharges; Frequency measurement; Mobile handsets; Noise; Radio frequency;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
DOI :
10.1109/ECTC.2014.6897369