Title :
Wafer-level non conductive films for exascale servers
Author :
Horibe, A. ; Kohara, S. ; Mori, Hisamichi ; Orii, Y. ; Kawamoto, Shota ; Sone, Hidekazu ; Hoshiyama, M.
Author_Institution :
IBM Res. - Tokyo, Tokyo, Japan
Abstract :
Wafer-Level Non Conductive Films (WLNCFs) were evaluated as a potential underfill solution for future exascale server packages. The fundamental chip-joining ability and reliability on a small die package were tested. The fillet shapes, fillet overcoating, adhesion strength, and simplifications of the chip joining conditions, and the thermomechanical stresses in relation to the lower CTE substrate were evaluated and assessed for the future advanced packages.
Keywords :
adhesion; chip scale packaging; films; joining processes; network servers; thermal expansion; wafer level packaging; CTE substrate; WLNCF; adhesion strength; chip joining conditions; chip-joining ability; chip-joining reliability; coefficient of temperature expansion; exascale server packages; fillet overcoating; fillet shapes; potential underfill solution; small die package; thermomechanical stresses; wafer-level non conductive films; Joints; Laminates; Reliability; Servers; Substrates; Viscosity;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
DOI :
10.1109/ECTC.2014.6897377
