Title :
Development of the technology to control the spatial distribution of plasma using double ICP coil
Author :
Sakuishi, Toshiyuki ; Murayama, Takahide ; Morikawa, Yasuhiro ; Suu, Koukou
Author_Institution :
ULVAC Inc., Susono, Japan
Abstract :
With the shrink of TSV diameter, smoothness of side wall and taper angle control become more and more important. We have developed scallop free etching by direct etching method. Direct etching method is continuous, not cyclical etching and deposition. Scallop does not occur in principle. Double ICP antenna newly developed has good controllability of side wall taper angle.
Keywords :
antennas in plasma; plasma deposition; plasma devices; sputter etching; ICP antenna; TSV diameter; cyclical etching; deposition; direct etching method; double ICP coil; scallop free etching; taper angle control; Antennas; Etching; Iterative closest point algorithm; Plasmas; Reliability; Silicon; Through-silicon vias;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
DOI :
10.1109/ECTC.2014.6897384
