DocumentCode :
2351368
Title :
4I-2 Ultrasonic Pulse-Echo NDE of Adhesive Bonds in Sheet-Metal Assemblies
Author :
Chapman, G.B. ; Sadler, J. ; Maev, R.G. ; Titov, S. ; Maeva, E.Y. ; Severina, I. ; Severin, F.
Author_Institution :
Dept. of Phys., Windsor Univ., Ont.
fYear :
2006
fDate :
2-6 Oct. 2006
Firstpage :
906
Lastpage :
909
Abstract :
The development of a 20 MHz pulse-echo method for nondestructive evaluation (NDE) of adhesive bonds was undertaken to provide assurance of bond integrity in vehicle body assemblies. This new NDE method features improvements over previous methods implemented in production, and extends the range of bond evaluation effectiveness. The NDE is accomplished by the acquisition and analysis of acoustic echoes that return from bond joints that have interfaces between layers with large acoustical impedance mismatch. These echoes reverberate in the multilayered joint structures and are captured for a computer-automated analysis that provides a rapid interpretation of the indications, and subsequently yields a simplified display of the inspection results
Keywords :
adhesive bonding; aerospace industry; automobile industry; inspection; ultrasonic materials testing; vehicles; 20 MHz; acoustical impedance mismatch; adhesive bonds; bond evaluation effectiveness; bond-joint inspection; computer-automated analysis; multilayered joint structures; nondestructive evaluation; sheet-metal assemblies; ultrasonic pulse-echo NDE; vehicle body assemblies; Adhesives; Assembly; Automotive engineering; Bonding; Delay lines; Inspection; Plastics; Probes; Sheet materials; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2006. IEEE
Conference_Location :
Vancouver, BC
ISSN :
1051-0117
Print_ISBN :
1-4244-0201-8
Electronic_ISBN :
1051-0117
Type :
conf
DOI :
10.1109/ULTSYM.2006.242
Filename :
4152098
Link To Document :
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