Title :
Series resistance at metal contact for thin film SOI MOSFET
Author :
Oh, Chann-Bonn ; Ahn, Jonghyon ; Lee, Sucheon ; Kim, Young-Wug ; Kim, Donghyun ; Kim, Bonggi
Author_Institution :
Samsung Semicond., San Jose, CA, USA
Abstract :
Thin-film silicon-on-insulator (TFSOI) MOSFET has emerged as a strong candidate for high performance, high density and latch-up free CMOS devices with less fabrication steps. Thin silicon film should be used to achieve good behavior in SOI MOSFET. However, most of the papers on TFSOI have reported high parasitic source/drain series resistance and contact resistance, which tends to obscure the performance advantages of SOI. In this paper, we examined effects of top silicon film thickness (Tsi) on contact series resistance and contact hole etching method
Keywords :
MOSFET; contact resistance; etching; semiconductor device metallisation; silicon-on-insulator; contact hole etching method; contact resistance; latch-up free CMOS devices; metal contact; parasitic source/drain series resistance; performance advantages; series resistance; thin film SOI MOSFET; top film thickness; Contact resistance; Dry etching; Electrical resistance measurement; Implants; MOSFET circuits; Semiconductor films; Semiconductor thin films; Silicon; Transistors; Wet etching;
Conference_Titel :
SOI Conference, 1994 Proceedings., 1994 IEEE International
Conference_Location :
Nantucket, MA
Print_ISBN :
0-7803-2406-4
DOI :
10.1109/SOI.1994.514226