Title :
Analysis of factors affecting component placement accuracy in SMT electronics assembly
Author :
Kamen, Edward ; Goldstein, Alex ; Creveling, Dan ; Sahinci, Erin ; Xiong, Zhijie
Author_Institution :
Center for Manuf. Res., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
In order to minimize the frequency of defects in SMT assembly it is necessary to understand the possible sources of errors that can lead to defects. In this paper, we consider various factors that may affect placement accuracy. Results based on experimental data are given on the relationship between placement accuracy and solder paste brick parameters, feeder location, component type, and z-axis placement force
Keywords :
assembling; circuit reliability; position control; printed circuit manufacture; soldering; surface mount technology; SMT assembly; SMT electronics assembly; assembly error sources; component placement accuracy factors; component type; defect frequency minimization; feeder location; placement accuracy; solder paste brick parameters; z-axis placement force; Application software; Area measurement; Assembly; Databases; Frequency; Inspection; Laboratories; Lead; Performance analysis; Printing; Surface-mount technology; Volume measurement;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-4523-1
DOI :
10.1109/IEMT.1998.731022
