Analysis of factors affecting component placement accuracy in SMT electronics assembly

Author

Kamen, Edward ; Goldstein, Alex ; Creveling, Dan ; Sahinci, Erin ; Xiong, Zhijie

Author_Institution

Center for Manuf. Res., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1998

fDate

19-21 Oct 1998

Firstpage

50

Lastpage

57

Abstract

In order to minimize the frequency of defects in SMT assembly it is necessary to understand the possible sources of errors that can lead to defects. In this paper, we consider various factors that may affect placement accuracy. Results based on experimental data are given on the relationship between placement accuracy and solder paste brick parameters, feeder location, component type, and z-axis placement force

Keywords

assembling; circuit reliability; position control; printed circuit manufacture; soldering; surface mount technology; SMT assembly; SMT electronics assembly; assembly error sources; component placement accuracy factors; component type; defect frequency minimization; feeder location; placement accuracy; solder paste brick parameters; z-axis placement force; Application software; Area measurement; Assembly; Databases; Frequency; Inspection; Laboratories; Lead; Performance analysis; Printing; Surface-mount technology; Volume measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-4523-1

Type

conf

DOI

10.1109/IEMT.1998.731022

Filename

731022