DocumentCode :
2351488
Title :
Investigation of body effect of fully depleted n channel SOI device as a function of body bias
Author :
Chen, Zongjian ; Ploeg, E.V. ; Shott, John ; Plummer, James D.
Author_Institution :
Center for Integrated Syst., Stanford Univ., CA, USA
fYear :
1994
fDate :
3-6 Oct 1994
Firstpage :
57
Lastpage :
58
Abstract :
There have been several papers on threshold voltage models for fully depleted SOI NMOS devices. The particular case of the fully depleted SOI MOSFET under negative substrate bias has been discussed previously. However all the discussion so far has dealt with the case of low drain bias (typically 0.1 V). The important case of higher drain bias (a typical bias condition in circuits) has not been studied in detail. In this paper, the characterization result from subhalf-micron fully depleted SOI MOSFETs under such bias conditions is presented, followed by an analysis through device simulation which reveals the device physics that determines threshold behavior under such bias conditions
Keywords :
MOSFET; semiconductor device models; silicon-on-insulator; MOSFET; bias conditions; body bias; body effect; device physics; device simulation; drain bias; fully depleted n channel SOI device; threshold behavior; Analytical models; Charge carrier processes; Circuit simulation; Fabrication; Impact ionization; MOS devices; MOSFET circuits; Physics; Structural engineering; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 1994 Proceedings., 1994 IEEE International
Conference_Location :
Nantucket, MA
Print_ISBN :
0-7803-2406-4
Type :
conf
DOI :
10.1109/SOI.1994.514233
Filename :
514233
Link To Document :
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