Title :
Partition-Recomposition Methodology for Accurate Electromagnetic Analysis of SiP Passive Circuitry
Author :
Wane, Sidina ; Bajon, Damienne
Author_Institution :
NXP-Semicond., Caen
Abstract :
A partition-recomposition methodology based on internal port concept associated to auxiliary sources, is proposed for electromagnetic (EM) analysis of SiP (system-in-package) off-chip and on-chip passive circuitry towards optimized passive and active frequency and time domain co-simulation. Attributes of internal ports and associated de-embedding procedures for local ground references are discussed. Application of the proposed methodology to off-chip SiP multi-conductors and functional components is presented. A broadband extraction methodology is applied to derive, from EM simulation results or measurement data of passive structures, Spice-compatible models for transient/SSN (simultaneous switching noise) analysis.
Keywords :
SPICE; circuit simulation; computational electromagnetics; passive networks; system-in-package; time-frequency analysis; SiP passive circuitry; Spice-compatible models; broadband extraction methodology; electromagnetic analysis; internal port concept; local ground references; off-chip SiP multiconductors; off-chip passive circuitry; on-chip passive circuitry; partition-recomposition methodology; passive structures; simultaneous switching noise analysis; system-in-package; Analytical models; Circuit simulation; Data mining; Electromagnetic analysis; Frequency domain analysis; Noise measurement; Optimization methods; System-on-a-chip; Time domain analysis; Transient analysis; Broadband Spice extraction; De-embedding of internal ports; Parasitics Extraction; Partition and Recomposition Methodology; SiP; local ground references;
Conference_Titel :
EUROCON, 2007. The International Conference on "Computer as a Tool"
Conference_Location :
Warsaw
Print_ISBN :
978-1-4244-0813-9
Electronic_ISBN :
978-1-4244-0813-9
DOI :
10.1109/EURCON.2007.4400496