Title :
V-band monolithic two stage HEMT amplifiers
Author :
Aust, M. ; Yonaki, J. ; Nakano, K. ; Berenz, J. ; Dow, G. ; Liu, L.C.T.
Author_Institution :
TRW Electron. & Technol. Div., Redondo Beach, CA, USA
Abstract :
Two different types of HEMT (high-electron-mobility transistor) monolithic low-noise amplifiers (LNAs) using AlGaAs/GaAs and pseudomorphic InGaAs/GaAs materials have been developed and have demonstrated excellent performance at 60 GHz. These monolithic LNAs have achieved noise figures of 5 dB, as well as associated gains of 11 dB. These two-stage circuits both utilize 0.2×60-μm HEMT devices for both bandpass and low-pass circuit topologies. Noise figures as low as 4.5 dB have been observed for single-stage MMIC- (monolithic-microwave-integrated-circuit) implemented LNAs, and gains in excess of 20 dB have been observed for three-stage versions of this amplifier with a 5-dB noise figure in the V band. This result represents the state-of-the-art monolithic HEMT amplifier performance for AlGaAs and pseudomorphic InGaAs materials. This MMIC amplifier can occupy about less than one-third the size of existing MIC hybrid V -band LNAs. This represents a significant size reduction and cost saving due to repeatable circuit performance with monolithic technology. The chip sizes are both 1.6×2.7 mm for these two-stage amplifiers
Keywords :
III-V semiconductors; MMIC; aluminium compounds; gallium arsenide; high electron mobility transistors; indium compounds; microwave amplifiers; 11 dB; 4.5 dB; 5 dB; 60 GHz; AlGaAs-GaAs; EHF; InGaAs-GaAs; MMIC amplifier; V-band; bandpass circuit; high-electron-mobility transistor; low-pass circuit topologies; monolithic low-noise amplifiers; monolithic-microwave-integrated-circuit; pseudomorphic materials; two stage HEMT amplifiers; Circuit topology; Gain; Gallium arsenide; HEMTs; Indium gallium arsenide; Low-noise amplifiers; MMICs; MODFETs; Microwave integrated circuits; Noise figure;
Conference_Titel :
Military Communications Conference, 1989. MILCOM '89. Conference Record. Bridging the Gap. Interoperability, Survivability, Security., 1989 IEEE
Conference_Location :
Boston, MA
DOI :
10.1109/MILCOM.1989.104021