DocumentCode :
235182
Title :
Methodology development of warpage analysis of polymer based packaging substrate
Author :
Cheolgyu Kim ; Taeik Lee ; Hyeseon Choi ; Min Sung Kim ; Taek-Soo Kim
Author_Institution :
Dept. of Mech. Eng., KAIST, Daejeon, South Korea
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
1004
Lastpage :
1009
Abstract :
Warpage of packaging substrate has been at issue due to thin and flexible substrate. It is occurred during manufacturing processes. Although warpage research based on thin metal film and silicon substrate was actively studied, it has difficulty about research of polymer based electronic due to its flexibility and low stiffness compared to metal and silicon substrate. We suggest a new methodology of warpage analysis to predict the warpage behavior of polymer composite substrate based bilayer specimen during temperature rising. The warpage analysis is performed in the sequence of scanning 3D surface, calculating curvature and built-in stress of film and verifying the result using FEM simulation. Two main factors of warpage behavior are built-in stress in film layer and stress induced by misfit of coefficient of thermal expansion between film and substrate. Built-in stress, arisen from built-in strain, is generated during film lay-up process such as electro-plating of copper, curing process of polymer. It is computed from the curvature at room temperature using the strain-curvature relation. Though this analysis method, the predicted curvature through temperature cycle showed good agreement with the experiment.
Keywords :
curing; electroplating; finite element analysis; polymers; semiconductor device packaging; FEM simulation; bilayer specimen; built-in strain; built-in stress; coefficient of thermal expansion; electroplating; flexible substrate; polymer based electronic; polymer based packaging substrate; polymer composite substrate; silicon substrate; thin metal film; thin substrate; warpage analysis; Equations; Films; Mathematical model; Shape; Strain; Stress; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
Type :
conf
DOI :
10.1109/ECTC.2014.6897410
Filename :
6897410
Link To Document :
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