DocumentCode :
235194
Title :
Three-dimensional high density channel integration of polymer optical waveguide using the mosquito method
Author :
Ishigure, Takaaki ; Suganuma, Daisuke ; Soma, Kazutomo
Author_Institution :
Fac. of Sci. & Technol., Keio Univ., Yokohama, Japan
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
1042
Lastpage :
1047
Abstract :
We experimentally demonstrate that the Mosquito method is capable of fabricating polymer optical waveguides with extremely narrow pitch. The Mosquito method we developed recently is a technique for directly writing polymer waveguides with circular cores on a substrate using a microdispenser. Actually, even when parallel cores are formed by repetitive horizontal scans of a syringe needle with a 230-μm outer diameter, a pitch of 40 μm is achieved. It is noteworthy that the pitch is almost one third of the outer needle radius. For the waveguide fabrication, a silicone resin (FX-712 form ADEKA Corp.) is used for the core, which is a sufficiently durable polymer material. Furthermore, we also represent in this paper that a three-dimensional channel integration is also realized with the Mosquito method by varying the vertical position of the needle tip in the cladding layer. To the best of our knowledge, this paper is the first report of three-dimensionally aligned fan-out polymer waveguide realized with GI-circular-core including the pitch and core-height conversions.
Keywords :
optical fabrication; optical polymers; optical waveguides; resins; silicones; FX-712; Mosquito method; circular cores; cladding layer; microdispenser; needle tip; parallel cores; polymer optical waveguides; repetitive horizontal scans; silicone resin; size 230 mum; size 40 mum; three-dimensional channel integration; three-dimensionally aligned fan-out polymer waveguide; Loss measurement; Needles; Optical device fabrication; Optical interconnections; Optical polymers; Optical waveguides;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
Type :
conf
DOI :
10.1109/ECTC.2014.6897416
Filename :
6897416
Link To Document :
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