DocumentCode :
2352027
Title :
Bipolar transistors under positive and negative gate bias stress
Author :
Maiga, C.O. ; Tala-Ighil, B. ; Toutah, H. ; Boudart, B.
Author_Institution :
Ecole d´Ingenieurs de Cherbourg, Laboratoire Univ. des Sci. Appliquees de Cherbourg, France
Volume :
2
fYear :
2005
fDate :
20-23 June 2005
Firstpage :
435
Abstract :
The work presented in this paper is concerned with the effects of a positive and of a negative gate bias stress on punch-through insulated gate bipolar transistors (PT-IGBT´s). Two selections of PT IGBT´s all of the same nominal range were gate biased at their positive and negative maximum gate-to-emitter voltage with drain and emitter short-circuited at 140 /spl deg/C during 1200 hours. A particular interest was taken in the switching parameters. Experimental results on their evolution under the two types of stress are presented in a quantified way. Then, a qualitative analysis of the effects of the switching times shift, due to the IGBT´s ageing, on a PWM inverter operation is presented.
Keywords :
PWM invertors; insulated gate bipolar transistors; power bipolar transistors; switching convertors; 140 degC; IGBT ageing; PWM inverter; gate bias stress; gate-to-emitter voltage; punch-through insulated gate bipolar transistor; qualitative analysis; short-circuit emitter; switching parameters; Aging; Bipolar transistors; Insulated gate bipolar transistors; MOSFET circuits; Manufacturing; Pulse width modulation inverters; Static power converters; Stress; Substrates; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics, 2005. ISIE 2005. Proceedings of the IEEE International Symposium on
Conference_Location :
Dubrovnik, Croatia
Print_ISBN :
0-7803-8738-4
Type :
conf
DOI :
10.1109/ISIE.2005.1528956
Filename :
1528956
Link To Document :
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