DocumentCode
2352183
Title
Cooling Microstructure for Automotive Electronic Module
Author
Widerski, Tomasz ; Raj, Ewa ; Lisik, Zbigniew
Author_Institution
Tech. Univ. of Lodz, Lodz
fYear
2007
fDate
9-12 Sept. 2007
Firstpage
1429
Lastpage
1432
Abstract
The paper presents the general overview of the cooling microstructure concept dedicated for automotive electronic systems. It introduces the first design stage of the micro heat sink and presents preliminary simulations that consider adaptation of automotive coolants. The theoretical discussion is supported by simulations and calculations that were led with the aid of ANSYS software.
Keywords
automotive electronics; coolants; cooling; heat sinks; ANSYS software; automotive coolants; automotive electronic module; cooling microstructure; micro heat sink; Automotive electronics; Automotive engineering; Consumer electronics; Control systems; Electronics cooling; Liquid cooling; Microstructure; Road safety; Temperature; Thermal management of electronics; IPM; automotive; cooling; microchannel;
fLanguage
English
Publisher
ieee
Conference_Titel
EUROCON, 2007. The International Conference on "Computer as a Tool"
Conference_Location
Warsaw
Print_ISBN
978-1-4244-0813-9
Electronic_ISBN
978-1-4244-0813-9
Type
conf
DOI
10.1109/EURCON.2007.4400540
Filename
4400540
Link To Document