Accelerated SLID bonding using thin multi-layer copper-solder stack for fine-pitch interconnections

Emerging 2.5D and 3D package-integration technologies for mobile and high-performance applications are primarily limited by advances in ultra-short and fine-pitch off-chip interconnections. A range of technologies are being pursued to advance interconnections, most notably with direct Cu-Cu interconnections or Cu pillars with solder caps. While manufacturability is still a major concern for the Cu-Cu interconnections technologies, the copper-solder approaches face limitations due to solder-bridging at fine-pitch, electromigration, and reliability issues. Thus, novel low-temperature, low-pressure, high-throughput, cost-effective and manufacturable technologies are needed to enable interconnections with pitches finer than 15 microns. This paper focuses on an innovative multi-layered copper-solder stack approach to achieve fine-pitch off-chip interconnections with no residual solders after assembly. Interconnections using this new technology enable higher current-handling because of the stable intermetallics, high-throughput assembly, and high yield even at low stand-off heights. The elimination of solder-intermetallic (IMC) interfaces is also expected to enhance the joint strength. This paper describes the design, fabrication, assembly and characterization of such stacked copper-solder interconnections. A detailed study of the effect of bonding parameters such as temperature and time on the rate of formation of stable Cu-IMC-Cu structures is presented. Test-vehicles were designed and fabricated as the first demonstration of this technology.