• DocumentCode
    2352798
  • Title

    Aging characterization of medium voltage groundwall insulation intended for PWM applications

  • Author

    Haq, Saeed Ul ; Jayaram, Shesha H. ; Cherney, Edward A.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont.
  • fYear
    2006
  • fDate
    11-14 June 2006
  • Firstpage
    143
  • Lastpage
    146
  • Abstract
    The paper describes an investigation into aging of medium voltage mica-based groundwall insulation when subjected to high frequency AC and steep-front pulse voltages. The test conditions adopted in this study involve 60 Hz, 3 kHz and 4 kHz AC frequencies, nanosecond rise time pulses with repetition rates up to 2000 pps, and at temperatures of 20 and 155 degC. The experimental data of time-to-failure in the accelerated life tests are presented by Weibull distributions. The parameters of the life model are developed that link the failure time to the amplitude and temperature of the applied voltages. The test method and the data processing adopted in this study are useful to characterize groundwall insulation in terms of improved vacuum pressure impregnation (VPI) and for applications at higher temperatures and frequencies
  • Keywords
    Weibull distribution; ageing; bars; failure analysis; impregnated insulation; life testing; machine insulation; machine testing; mica; stators; 155 C; 20 C; 3 kHz; 4 kHz; 60 Hz; PWM application; Weibull distribution; accelerated life test; aging characterization; medium voltage groundwall insulation; mica-based insulation; stator bar; time-to-failure data processing; vacuum pressure impregnation; Aging; Frequency; Insulation; Life estimation; Life testing; Medium voltage; Pulse width modulation; Space vector pulse width modulation; Temperature; Weibull distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2006. Conference Record of the 2006 IEEE International Symposium on
  • Conference_Location
    Toronto, Ont.
  • ISSN
    1089-084X
  • Print_ISBN
    1-4244-0333-2
  • Type

    conf

  • DOI
    10.1109/ELINSL.2006.1665277
  • Filename
    1665277