Title :
Development of the base technology for surface multichipping modules on the multilayer polyimide boards having the increased mounting density of the add-on components and using modification 2 chip ic in order to organize production of the microelectronic
Author_Institution :
NPO ELAS
Keywords :
Assembly; Ceramics; Frequency; Nonhomogeneous media; Packaging; Pins; Polyimides; Production; Soldering; Substrates;
Conference_Titel :
Satellite Communications, 1996. Proceedings of ICSC '96. The 2nd International Conference on
DOI :
10.1109/ICSC.1996.864268
