DocumentCode
2353540
Title
1.1 GHz MSM photodiodes on relaxed Si/sub 1-x/Ge/sub x/ grown by UHV-CVD
Author
Koester, S.J. ; Klepser, B.-U. ; Chu, J.O. ; Kuchta, Daniel ; Ismail, K.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
1998
fDate
22-24 June 1998
Firstpage
60
Lastpage
61
Abstract
The growing market for /spl lambda/=850 nm data links that operate at bit rates >1 Gbit/sec has increased the interest in Si-based monolithically integrated photoreceivers due to the reduced cost arising from their compatibility with existing Si manufacturing technology. However, Si integrated photoreceivers have had difficulty achieving frequency performance comparable to traditional GaAs monolithic photoreceivers, mainly due to the long absorption length (/spl alpha//sup -1/=20 /spl mu/m) for 850 nm radiation in Si. Si/sub 1-x/Ge/sub x/ alloys emerge as a means of overcoming the inherent speed/responsivity trade-offs of bulk Si photodiodes, due to the much shorter absorption length and the higher carrier mobilities of Si/sub 1-x/Ge/sub x/ alloys compared to Si. Though recent results using strained Si/sub 1-x/Ge/sub x/ layers on Si have shown promise for improved photoreceiver performance, strained-layer absorbing regions have limitations because the overall Ge composition must be kept low enough to avoid dislocation formation. In this paper, we present results on MSM photodiodes fabricated on relaxed absorbing layers of single-crystal Si/sub 0.75/Ge/sub 0.25/ grown epitaxially on Si substrates. These photodiodes have bandwidths in excess of 1 GHz and have the distinct advantage of being fully compatible with Si-SiGe high-electron mobility transistors (HEMTs).
Keywords
Ge-Si alloys; carrier mobility; chemical vapour deposition; high electron mobility transistors; light absorption; metal-semiconductor-metal structures; optical receivers; photodiodes; semiconductor growth; semiconductor materials; stress relaxation; vapour phase epitaxial growth; 1.1 GHz; 20 micron; 850 nm; GaAs monolithic photoreceivers; Ge composition; MSM photodiodes; Si; Si integrated photoreceivers; Si manufacturing technology; Si substrates; Si-SiGe; Si-SiGe HEMT compatibility; Si-SiGe high-electron mobility transistors; Si-based monolithically integrated photoreceivers; Si/sub 0.75/Ge/sub 0.25/-Si; Si/sub 1-x/Ge/sub x/ alloys; UHV-CVD; absorption length; bit rate; bulk Si photodiodes; carrier mobility; data links; dislocation formation; epitaxial growth; frequency performance; photodiodes; photoreceiver cost; photoreceiver performance; relaxed Si/sub 1-x/Ge/sub x/; relaxed absorbing layers; single-crystal Si/sub 0.75/Ge/sub 0.25/; speed/responsivity trade-offs; strained Si/sub 1-x/Ge/sub x/ layers; strained-layer absorbing regions; Absorption; Bit rate; Costs; Frequency; Germanium alloys; HEMTs; MODFETs; Manufacturing; Photodiodes; Silicon alloys;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference Digest, 1998. 56th Annual
Conference_Location
Charlottesville, VA, USA
Print_ISBN
0-7803-4995-4
Type
conf
DOI
10.1109/DRC.1998.731121
Filename
731121
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