1995 Proceedings. 45th Electronic Components and Technology Conference

fYear

1995

fDate

21-24 May 1995

Abstract

The following topics were dealt with: single chip packaging-ball grid arrays; component processing; wire and conductive polymer interconnect; high density connectors; photonic packaging techniques; component performance enhancements; reliability design and testing; electrical modeling and simulation; VCSEL modules and packaging; package moisture sensitivity and die cracking; fine line MCMs; materials technologies; parallel optical interconnects; packaging design and architecture; 3D MCM and high density interconnections; adhesion technology and materials; optical amplifiers and hybrid packaging; mechanical modeling and simulation; BGA manufacturing technology; materials for packaging and interconnection; telecommunications opto-device packaging; thermal simulation; flip chip interconnections; soldering and encapsulation processes

Keywords

adhesion; electric connectors; electronic engineering computing; electronic equipment manufacture; electronic equipment testing; encapsulation; flip-chip devices; integrated circuit interconnections; integrated circuit technology; materials science; modules; multichip modules; optical interconnections; optoelectronic devices; packaging; reliability; soldering; VCSEL modules; ball grid arrays; component performance enhancements; component processing; conductive polymer interconnect; die cracking; electrical modeling; electrical simulation; fine line MCMs; high density connectors; materia; mechanical simulation; package moisture sensitivity; packaging architecture; packaging materials; photonic packaging techniques; reliability design; reliability testing; single chip packaging; wire interconnect;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV, USA

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.514353

Filename

514353