Title :
1995 Proceedings. 45th Electronic Components and Technology Conference
Abstract :
The following topics were dealt with: single chip packaging-ball grid arrays; component processing; wire and conductive polymer interconnect; high density connectors; photonic packaging techniques; component performance enhancements; reliability design and testing; electrical modeling and simulation; VCSEL modules and packaging; package moisture sensitivity and die cracking; fine line MCMs; materials technologies; parallel optical interconnects; packaging design and architecture; 3D MCM and high density interconnections; adhesion technology and materials; optical amplifiers and hybrid packaging; mechanical modeling and simulation; BGA manufacturing technology; materials for packaging and interconnection; telecommunications opto-device packaging; thermal simulation; flip chip interconnections; soldering and encapsulation processes
Keywords :
adhesion; electric connectors; electronic engineering computing; electronic equipment manufacture; electronic equipment testing; encapsulation; flip-chip devices; integrated circuit interconnections; integrated circuit technology; materials science; modules; multichip modules; optical interconnections; optoelectronic devices; packaging; reliability; soldering; VCSEL modules; ball grid arrays; component performance enhancements; component processing; conductive polymer interconnect; die cracking; electrical modeling; electrical simulation; fine line MCMs; high density connectors; materia; mechanical simulation; package moisture sensitivity; packaging architecture; packaging materials; photonic packaging techniques; reliability design; reliability testing; single chip packaging; wire interconnect;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.514353
