Ceramic mini-ball grid array package for high speed device

Author

Master, Raj N. ; Jackson, R. ; Ray, S.K. ; Ingraham, A.

Author_Institution

East Fishkill Lab., IBM Corp., Hopewell Junction, NY, USA

fYear

1995

fDate

21-24 May 1995

Firstpage

46

Lastpage

50

Abstract

We have developed a Ceramic Mini Ball Grid Array (BGA) package for a high speed switch chip (200 MHz) application. In this paper, we describe the 0.5 mm pitch mini BGA package and the processes developed to fabricate this package. In addition, a matching ceramic socket that was developed to test the high speed switch chips is also briefly reviewed. The mini-BGA process enabled the packaging of the switch chip in a 21 mm ceramic substrate with 1521 solder ball connections. The main difference between the mini solder ball connections described here and conventional ceramic ball grid array (CBGA) packages is that 60/40 Pb/Sn eutectic solder is used in the mini-BGA package compared to 90/10 Pb/Sn solder balls used in CBGA packages

Keywords

packaging; 0.5 mm; 200 MHz; Pb-Sn; ceramic mini-ball grid array package; ceramic socket; ceramic substrate; eutectic solder; fabrication; high speed switch chips; mini BGA package; solder ball connections; Capacitors; Ceramics; Chip scale packaging; Clocks; Electronics packaging; Integrated circuit interconnections; Microelectronics; Noise reduction; Switches; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.514360

Filename

514360