DocumentCode
2353730
Title
High-voltage accumulation-layer UMOSFETs in 4H-SiC
Author
Tan, J. ; Cooper, J.A., Jr. ; Melloch, M.R.
Author_Institution
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
fYear
1998
fDate
22-24 June 1998
Firstpage
88
Lastpage
89
Abstract
During the past year, the performance of SiC power MOSFETs exceeded the theoretical limits of silicon devices for the first time. This milestone was achieved by the introduction of the first SiC accumulation-layer UMOSFET (U-ACCUFET) in 1997. In this device, an accumulation-layer channel is formed under the MOS diode by an n-type epitaxial layer on the sidewalls of the UMOS trench. The high electron mobility in the accumulation channel reduced the specific on-resistance to 10.9 mΩ-cm/sup 2/, the lowest value yet reported for a SiC power MOSFET. Although the blocking voltage of the device is only 450 V, the figure-of-merit V/sub B//sup 2//R/sub ON/ is 18.6 MW/cm/sup 2/, the highest value reported at that time for a SiC power MOSFET and about 4× higher than the theoretical limit for silicon MOSFETs. In this paper, we report an improved UMOS ACCUFET incorporating structural innovations that increase the blocking voltage to 850 V while maintaining a low on-resistance of 27 mΩ-cm/sup 2/. The resulting V/sub B//sup 2//R/sub ON/ is 26.8 MW/cm/sup 2/, about 6× higher than the theoretical limit for silicon.
Keywords
accumulation layers; electric resistance; electron mobility; isolation technology; power MOSFET; semiconductor device testing; semiconductor epitaxial layers; silicon compounds; wide band gap semiconductors; 450 V; 4H-SiC UMOSFETs; 850 V; MOS diode; Si; SiC; SiC accumulation-layer UMOSFET; SiC power MOSFET; SiC power MOSFETs; U-ACCUFET; UMOS ACCUFET; UMOS trench sidewalls; accumulation channel; accumulation-layer channel; blocking voltage; electron mobility; figure-of-merit; high-voltage accumulation-layer UMOSFETs; n-type epitaxial layer; on-resistance; silicon devices; specific on-resistance; Design optimization; Immune system; Implants; MOSFETs; Neodymium; Oxidation; Power engineering and energy; Power engineering computing; Silicon carbide; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference Digest, 1998. 56th Annual
Conference_Location
Charlottesville, VA, USA
Print_ISBN
0-7803-4995-4
Type
conf
DOI
10.1109/DRC.1998.731133
Filename
731133
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