Title : 
Analyzing software influences on substrate noise: an ADC perspective
         
        
            Author : 
Kang, Byungtae ; Vijaykrishnan, N. ; Irwin, Mary Jane
         
        
            Author_Institution : 
Samsung, South Korea
         
        
        
        
        
        
            Abstract : 
Substrate noise affects the performance of mixed signal integrated circuits. Power supply (di/dt) noise is the dominant source of substrate noise. There have been various attempts at the circuit and software levels to estimate this noise. Software-level noise estimation is especially important, as designing noise tolerant circuits for all circumstances may be prohibitively expensive. In this paper, we propose a new software approach for estimating di/dt noise and incorporate it into a power simulator in order to investigate the influence of software on substrate noise. As a case study, we investigate how an analog-to-digital converter (ADC) can be designed to adapt its resolution in the presence of substrate noise generated by a embedded processor core. The proposed strategies prevent unexpected ADC performance degradations.
         
        
            Keywords : 
analogue-digital conversion; circuit simulation; integrated circuit noise; mixed analogue-digital integrated circuits; ADC performance degradation; analog-to-digital converter; embedded processor core; mixed signal integrated circuits; noise tolerant circuits; power simulator; power supply noise; software influences; software-level noise estimation; substrate noise; Analog-digital conversion; Circuit noise; Circuit simulation; Degradation; Distributed power generation; Integrated circuit noise; Mixed analog digital integrated circuits; Noise generators; Noise level; Power supplies;
         
        
        
        
            Conference_Titel : 
Computer Aided Design, 2004. ICCAD-2004. IEEE/ACM International Conference on
         
        
        
            Print_ISBN : 
0-7803-8702-3
         
        
        
            DOI : 
10.1109/ICCAD.2004.1382707