• DocumentCode
    2353974
  • Title

    A high density edge connector

  • Author

    Campbell, J. ; Holton, J. ; Knight, A.

  • fYear
    1995
  • fDate
    21-24 May 1995
  • Firstpage
    140
  • Lastpage
    143
  • Abstract
    A connector using new technology concepts has been developed for high density, high performance applications that is reliable and cost effective. Molding and batch panel processing operations minimizes component fabrication costs. The modular design allows for flexibility in applications without massive tooling investments. Electrical performance supports high data transfer rates with excellent reliability at a competitive cost. Low force per contact minimizes the complexity of the force containment structures and the no contact wipe requirement simplifies the connector actuation hardware. Solderless attachment to the card results in environmentally safe assembly operations and the simple guide and actuation elements minimizes manufacturing and assembly expense
  • Keywords
    electric connectors; printed circuit accessories; PC card connector; batch panel processing operations; environmentally safe assembly operations; force containment structures; high data transfer rates; high density edge connector; high performance applications; modular design; molding operations; reliability; solderless attachment; Assembly; Atherosclerosis; Conductive films; Connectors; Contact resistance; Flexible electronics; Flexible printed circuits; Geometry; Impedance; Integrated circuit interconnections;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1995. Proceedings., 45th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-2736-5
  • Type

    conf

  • DOI
    10.1109/ECTC.1995.514374
  • Filename
    514374