DocumentCode
2354125
Title
Efficient Don´t Care Filling for Power Reduction during Testing
Author
Kundu, Subhadip ; Chattopadhyay, Santanu
Author_Institution
Dept. of Electron. & Electr. Commun., Indian Inst. of Technol. Kharagpur, Kharagpur, India
fYear
2009
fDate
27-28 Oct. 2009
Firstpage
319
Lastpage
323
Abstract
Power consumption during test mode is much higher than in normal mode of operation. This paper addresses issue of assigning suitable values to the unspecified bits (don´t care) in the test patterns so that both static and dynamic power consumption during testing is reduced. We have used a genetic algorithm based heuristic to fill the don´t cares. Our approach produces an average percentage improvement of 31.9, 37.0, and 37.7 in dynamic power and 3.0, 7.4, and 5.3 leakage power over 0-fill, 1-fill, and MT-fill algorithms for don´t care filling, considering the test patterns having unspecified bits in ISCAS´89 benchmark suite.
Keywords
CMOS analogue integrated circuits; automatic test pattern generation; benchmark testing; genetic algorithms; integrated circuit testing; leakage currents; low-power electronics; ATPG generated test pattern; CMOS circuit; ISCAS´89 benchmark circuit; analog design; don´t care filling; genetic algorithm; leakage current; power consumption; power reduction; Automatic test pattern generation; Circuit testing; Communications technology; Electronic equipment testing; Energy consumption; Filling; Hamming distance; Leakage current; Minimization; Probability; Don´t Care; GA; Leakage current; Switching Activity;
fLanguage
English
Publisher
ieee
Conference_Titel
Advances in Recent Technologies in Communication and Computing, 2009. ARTCom '09. International Conference on
Conference_Location
Kottayam, Kerala
Print_ISBN
978-1-4244-5104-3
Electronic_ISBN
978-0-7695-3845-7
Type
conf
DOI
10.1109/ARTCom.2009.141
Filename
5329428
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