Lab sessions and prototyping in interconnection and packaging education

Author

Illyefalvi-Vitéz, Zsolt ; Ruszinkó, Miklós ; Pinkola, János ; Harsányi, Gábor

Author_Institution

Dept. of Electron. Technol., Budapest Tech. Univ., Hungary

fYear

1998

fDate

19-21 Oct 1998

Firstpage

362

Lastpage

372

Abstract

The preparation of electronics engineers for the 21st century´s requirements in microelectronics interconnection and packaging is a real challenge for current education. An approach that teaches interconnection and packaging technology, providing lecture courses, lab sessions and independent research studies supported by a prototype manufacturing environment can hopefully achieve the main goals. Supporting projects are essential to develop the prototyping laboratories and to join to the international education network in the field

Keywords

educational courses; electronic engineering education; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; laboratory techniques; student experiments; education; electronics engineers; independent research studies; interconnection education; interconnection technology; laboratory sessions; lecture courses; microelectronics interconnection; microelectronics packaging; packaging education; packaging technology; prototype manufacturing environment; prototyping; prototyping laboratories; Computer science education; Design engineering; Electronics industry; Electronics packaging; Informatics; Integrated circuit interconnections; Manufacturing; Materials science and technology; Microelectronics; Prototypes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-4523-1

Type

conf

DOI

10.1109/IEMT.1998.731159

Filename

731159