Title :
The curing classifier of dielectrics based on epoxy resins
Author :
Mentlik, V. ; Pihera, J. ; Polansky, R. ; Prosr, P. ; Trnka, P.
Author_Institution :
Univ. of West Bohemia, Pilsen
Abstract :
Monitoring of the properties and applicability of high-voltage insulating systems containing epoxy resins require knowledge of curing degree of these resins. This curing degree is considered to be the key parameter for quality of materials used for these systems. Application of differential thermal analysis (DTA) for evaluation of curing degree of three-component composite materials (glass fabric, reconstructed mica, and epoxy resin) is presented in the article. Used analysis enables to observe characteristic structural parameter-the concentration of reaction-able particles in organic component of this material. In our investigation, concept of curing reactions courses was obtained as well as details for determination of optimal curing time of material. These conclusions have been verified with the other methods such as thermomechanical analysis (TMA) or loss factor and permittivity determination. Based upon these results it is obvious, that the conclusions correspond to one another
Keywords :
composite insulating materials; curing; differential thermal analysis; epoxy insulation; permittivity; polymer structure; composite material; curing classifier; dielectrics; differential thermal analysis; epoxy resin; glass fabric; high-voltage insulating system; monitoring; organic component; permittivity; reconstructed mica; thermomechanical analysis; Composite materials; Curing; Dielectric materials; Dielectrics and electrical insulation; Epoxy resins; Fabrics; Glass; Monitoring; Organic materials; Thermomechanical processes;
Conference_Titel :
Electrical Insulation, 2006. Conference Record of the 2006 IEEE International Symposium on
Conference_Location :
Toronto, Ont.
Print_ISBN :
1-4244-0333-2
DOI :
10.1109/ELINSL.2006.1665354