Evaluation of conductive adhesives for industrial SMT assemblies

Author

Périchaud, M.G. ; Deletage, J.Y. ; Frémont, H. ; Danto, Y. ; Faure, C. ; Salagoïty, M.

Author_Institution

IXL, Talence, France

fYear

1998

fDate

19-21 Oct 1998

Firstpage

377

Lastpage

385

Abstract

Microelectronics assemblies realized with different isotropic conductive adhesives as an alternative for solder are evaluated. The cure schedule is optimized by physical/chemical analyses. Electrical measurements show the evolution of the adhesive joints during accelerated life tests, and SEM observations reveal the failure mechanisms. Finite element simulations confirm the experimental results and permit, by varying parameters, to define the more reliable assembly configurations

Keywords

adhesives; assembling; circuit reliability; conducting polymers; failure analysis; finite element analysis; heat treatment; integrated circuit packaging; life testing; printed circuit manufacture; printed circuit testing; scanning electron microscopy; surface mount technology; SEM; accelerated life tests; adhesive joints; chemical analysis; conductive adhesives; cure schedule; cure schedule optimization; electrical measurements; failure mechanisms; finite element simulations; industrial SMT assemblies; isotropic conductive adhesives; microelectronics assemblies; physical analysis; reliable assembly configurations; solder replacement; Assembly; Chemical analysis; Conductive adhesives; Electric variables measurement; Job shop scheduling; Life estimation; Life testing; Microelectronics; Numerical analysis; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-4523-1

Type

conf

DOI

10.1109/IEMT.1998.731161

Filename

731161