DocumentCode
2354227
Title
Simple-structure, generally applicable chip-scale package
Author
Matsuda, Shuichi ; Kata, Keiichiro ; Hagimoto, Eiji
Author_Institution
VLSI Package Dev. Dept., NEC Corp., Sagamihara, Japan
fYear
1995
fDate
21-24 May 1995
Firstpage
218
Lastpage
223
Abstract
One way to provide the ultimate shrinkage, required for the fabricating of small, lightweight, and high-performance electrical devices is by using chip-scale packaging. We have therefore developed an original chip-scale package called fine-pitch BGA (FPBGA), which has a very simple structure, consisting of carrier tape, an adhesive layer, and solder bumps. Its assembly process is similar to that of TCP assembly, and FPBGA has many advantages over other IC mounting processes and other similar chip-scale packages
Keywords
fine-pitch technology; integrated circuit packaging; IC mounting; adhesive layer; assembly; carrier tape; chip-scale package; electrical devices; fine-pitch BGA; solder bump; Assembly; Chip scale packaging; Conductive films; Costs; Fabrication; Integrated circuit packaging; Packaging machines; Resins; Sockets; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-2736-5
Type
conf
DOI
10.1109/ECTC.1995.514387
Filename
514387
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