Title :
Simple-structure, generally applicable chip-scale package
Author :
Matsuda, Shuichi ; Kata, Keiichiro ; Hagimoto, Eiji
Author_Institution :
VLSI Package Dev. Dept., NEC Corp., Sagamihara, Japan
Abstract :
One way to provide the ultimate shrinkage, required for the fabricating of small, lightweight, and high-performance electrical devices is by using chip-scale packaging. We have therefore developed an original chip-scale package called fine-pitch BGA (FPBGA), which has a very simple structure, consisting of carrier tape, an adhesive layer, and solder bumps. Its assembly process is similar to that of TCP assembly, and FPBGA has many advantages over other IC mounting processes and other similar chip-scale packages
Keywords :
fine-pitch technology; integrated circuit packaging; IC mounting; adhesive layer; assembly; carrier tape; chip-scale package; electrical devices; fine-pitch BGA; solder bump; Assembly; Chip scale packaging; Conductive films; Costs; Fabrication; Integrated circuit packaging; Packaging machines; Resins; Sockets; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.514387
